The Dedicated Solution for the Development of 3D and MEMS Packaging Technologies
The third generation MA/BA8 Mask and Bond Aligner represents the latest development of SUSS MicroTec’s manual aligner platform for industrial research and operator assisted production. The MA/BA8 is the new benchmark in full-field lithography for MEMS, Advanced Packaging, 3D Integration and Compound Semiconductor markets. In addition, it supports emerging processes like UV-NIL, bond alignment, UV-bonding as well as wafer level microlens imprinting and assembly.
Because of their ability to easily process virtually all kinds of wafer and substrate materials, manual aligners are increasingly used in production environments. With the new MA/BA8 SUSS MicroTec addresses the growing demand for tighter process control coupled with high yield. The MA/BA8 is a highly versatile system for R&D and operator-assisted production. In addition it allows easy and fast upgrades to complementary technologies.
Product Highlights
High resolution (HR) optics allow patterning of structures below 0.5μm
Advanced semi-automatic functions for maximum process control
Processes compatibility with automatic equipment
Optimized splitfield microscope with eyepieces. Direct viewing and/or LCD flat screen options possible
MA/BA8
System Solution for 200mm Lithography Applications
The SUSS MicroTec MA8 Mask Aligner is the system solution for 200mm lithography applications for development and pilot production of IC back end processes. The MA8 provides full laboratory mask aligner versatility and flexibility. The compatibility of the exposure modes allows processes to be developed on the MA8 which can then be run in production on a SUSS MicroTec MA200 Production Mask Aligner.
The MA8 meets the requirements of back end applications such as passivation and thin film bumping. Thick resist performance also recommends the MA8 for microsystem technology applications where bottom side alignment is requested. The MA8 is also regarded as an ideal tool for telecom and optoelectronics applications.
Product Highlights
Multiple exposure modes and precise gap setting for optimized lithography processes
Dual video or eye piece microscope
BSA microscope with dual magnification
SUSS image storage for precision alignment even in large gaps
Optimum exposure quality also in thick resists:
steep edge slopes and high aspect ratio
MA/BA6 (Gen2)
The Lithography Benchmark from R&D to 3D MEMS Production
The SUSS MicroTec MA/BA6 Mask Aligner is regarded as the benchmark from semiconductor submicron research to 3D micro-system production. The innovative systems meets customer's needs for precision, reliability and low cost of ownership.
The MA6 is designed for all standard lithography applications. For thick resist MEMS applications the MA6 offers high quality exposure optics for high resolution and optimum edge quality. The Bottom Side Alignment option allows for pattern printing on both sides of the substrate. In addition the MA6 offers tailored features for fragile III-V compounds, thinned or warped wafers.
In addition the MA/BA6 Mask Aligner offers special techniques for bond alignment, Imprinting, and Near Field Holography.
Product Highlights
Accurate and precise gap setting for higher yield
Parameter storage saves set-up time and improves process consistency
High-quality exposure optics: Diffraction reducing lenses provide high resolution and optimum edge quality with thick resists
High intensity light sources reduce process time
Intelligent exposure control unit monitors lamp intensity and life time
Upgradable with retrofit kits for Nano Imprint Lithography (NIL)
MJB4
State-of-the Art R&D Solution for Small Substrates and Pieces
Easy to use and compact in size the SUSS MicroTec MJB4 represents the perfect system for laboratories and small volume production. As an inexpensive photolithography solution the MJB4 has set industry standards specifically for processing of small substrates and pieces up to 100mm. Equipped with a reliable, high precision alignment and high resolution printing capability in the submicron range the MJB4 demonstrates a performance unsurpassed by any comparable machine.
The MJB4 is widely used for MEMS and optoelectronics applications, such as LED production. It can be specifically configured for nonstandard substrates such as hybrids and high-frequency components for fragile III-V materials. In addition the MJB4 can be optionally enhanced with an upgrade kit for UV- Nanoimprint Lithography.
Product Highlights
High resolution printing down to 0.5µm
Fast and accurate alignment with SUSS Singlefiedl or Splitfield Microscope
High Resolution Optics optmized for thick resists
The Universal Optics Option for fast switching between different wavelengths
Upgradable with a retrofit kit for UV-Nanoimprint Lithography
Process Tools 
