PECVD

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Nanotechnology & Semiconductor

Process Tools

PECVD

Vision 310 Mk II PECVD system - Advance Vacuum

The Vision 310 Mk II PECVD (plasma enhanced chemical vapor deposition) system is one of the most versatile and flexible plasma deposition systems availabe today. The system is based on the robust control platform DeviceNet ensuring reliable and troublefree operation. The system is capable of depositing a number of different films, including Silicon Dioxide (SiO2), Silicon Nitride (Si3N4), Silicon Oxynitride (SiON), Silicon Carbide (SiC) and amorphous Silicon (a-Si). The substrate table on the system is 305mm in diameter allowing processing on a diameter up to 270mm in diameter.

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