SUSS MicroTec's proprietary AltaSpray coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D microstructures. The AltaSpray technology is capable of coating 90° corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few microns to 600µm and more. The ability to produce conformal resist coatings on severe topography makes them the ideal choice for R&D, MEMS, 3D-integration and Wafer Level Packaging applications like 3D image sensor packaging.
SUSS MicroTec Delta AltaSpray is the ideal tool for R&D and low-volume fabrication. Substrates up to 200mm in diameter and square subsrates up to 6" edge length can be processed. The system can be equipped with up to two separate spray dispense systems. The sophisticated resist supply system offers unmatched process stability and reproducibility. All spray and cleaning parameters can be programmed in the recipe.
The manual product line of SUSS MicroTec coaters offers easy recipe transfer to automated platforms.
Product Highlights
Enabling technology for patterning across severe topography
Conformal coating with top edge coverage while avoiding resists accumulation in trenches
Proprietary spray design for optimal process stability and reproducibility
Substrate sizes up to 200mm in diameter and square substrates up to 6" edge length
Up to 2 separate spray dispense systems to avoid cross contamination
Laptop with Windows XP operating system and MMC controller software
All process parameters are programmable in the recipe
Delta 12RC
Universal Coating System for Wafers up to 300mm
The Delta 12RC is the ideal platform for manual and semi-automated spin coating processes in R&D and low-volume fabrication. Substrates up to 300mm in diameter and square substrates up to 9" edge length can be processed. SUSS MicroTec Delta12RC offers GYRSET® closed cover coating technology. Open bowl coating is possible with programmable z-height for defined distance between the substrate and cover. The GYRSET® closed cover coating technology offers enhanced uniformity and significant cost savings of up to 60 percent, depending on resist chemistry.
The manual product line of SUSS MicroTec coaters offers easy recipe transfer to automated platforms.
The ability to produce resist thicknesses in the range of below 1µm to over 100µm makes them the ideal choice for R&D, MEMS, Wafer Level Packaging and the compound semiconductor industry.
Product Highlights
GYRSET® technology and traditional open bowl spinning for all major applications
Large selection of resist pumps as well as standard and customized chucks
Programmable dispense arm with up to 4 resist lines or 2 lines plus motorized syringe dispense option
Brushless servomotor operating in a closed loop mode provides spin speeds up to 3.000 rpm
Chuck indexing for easy load / unload
Laptop with Windows XP operating system and MMC controller software
Delta 80RC
Universal Spin Coating System for Wafers up to 200mm
The Delta 80RC is the ideal platform for manual and semi-automated spin coat and puddle develop processes in R&D and low-volume fabrication. A wide variety of substrates including pieces, wafers from 2" to 200mm in diameter and square substrates from 2" up to 6" edge length can be processed.
SUSS MicroTec Delta 80RC offers both, GYRSET® closed cover coating as well as conventional open bowl coating with high acceleration capabilities needed for some thin resist applications. The GYRSET® closed cover coating technology offers enhanced uniformity and significant cost savings of up to 60 percent, depending on resist chemistry.
The Delta 80 can also be used for puddle develop processes using aqueous based chemistry.
The manual product line of SUSS MicroTec coaters and developers offers easy recipe transfer to automated platforms.
The ability to produce resist thicknesses in the range of below 1µm to over 100µm makes them the ideal choice for R&D, MEMS, Wafer Level Packaging and the compound semiconductor industry.
SUSS MicroTec Delta 80RC is available as stand-alone or bench-mounted system. The Delta80RC is engineered to comply with the most stringent safety requirements (SEMI S2). For open bowl spin processing >1000 rpm the system is equipped with an upper enclosure.
Product Highlight
GYRSET® technology and traditional open bowl spinning for all major applications
Puddle develop capability
Large selection of resist pumps as well as standard and customized chucks
Programmable dispense arm with up to 4 resist lines or 2 lines plus motorized syringe dispense option
Brushless servomotor operating in a closed loop mode provides spin speeds up to 10.000 rpm
Up to 20 recipes with 40 steps can be stored in the standard controller
Chuck indexing for easy load / unload
Laptop option
ACS300 Gen2
Production Spin Coat / Develop Cluster for Wafer Level Packaging
The ACS300 Gen2 is a modular cluster system designed to meet manufacturers' needs for clean, reliable, high throughput, and modular photolithography processing for 200 and 300mm wafers without mechanical changeover. SUSS MicroTec ACS300 Gen2 systems can be equipped with process modules for HMDS vapor priming, spin coating, spray coating, aqueous or solvent based wet processing, baking and cooling. It masters thin and thick resist applications as well as photosensitive polymers like polyimide and Cyclotene (BCB). SUSS MicroTec ACS300 Gen2 addresses all requirements for sophisticated resist processing and the 3D-Integration and Wafer Level Packaging technology in particular.
ACS300 Gen2 allows flexible production planning from R&D/pilot production to the volume production stage. A small footprint configuration comes with 2 load port modules directly attached to the basic frame which guarantees for optimum cost-of-ownership. With a separate EFEM the machine can be equipped with 4 load port modules. It is equipped a high-precision 6-axis robot and camera based centering. With the GYRSET feature highly uniform resist layers with thicknesses from below 1µm to over 100µm can be produced in the process bowl.
The ACS300 Gen2 can be interfaced with the MA300 Gen2 proximity mask aligner to form the integrated LithoPack300 cluster.
Product Highlights
Concurrent 200 and 300mm wafer processing without mechanical changeover
High-speed, high precision six-axis robot and optical centering
Excellent thick resist capabilities and best-in-class EBR performance
Process Tools 
