| (SUSS MicroTec) - Wafer Level Cameras - Novel Fabrication and Packaging Technologies |
|
This paper explores the latest fabrication techniques as used in the Wafer Level Cameras (WLC) where Opto Wafers and CMOS-Wafers are mounted by Wafer Level Packaging (WLP) and describes all the challenges and available solutions. The processing issues encountered in those techniques are discussed with a focus on each WLC process step.
A typical Wafer Level Camera layout (Fig. 1) is described, the replication of microlenses and the packaging of such microlens wafers (Opto Wafers) via UV curing is depicted as well. Also wafer level packaging of the CMOS wafer using bonding techniques is part of this paper. UV curable materials for microlens replication and for Wafer Level Packaging of Opto Wafers (lens stacking) is presented as well. Optical measurement technology for quality assurance of micro-lenses finally concludes the paper. Authors: Margarete Zoberbier, Sven Hansen, Marc Hennemayer, Ralph Zoberbier - SUSS MicroTec
|
